| Research Projects |
Advisor |
Budget |
Duration |
LDPC Encoder/Decoder IP Design for MLC Flash Memory
100-S-C47 |
Wu, An-Yeu (Andy) |
2400000 |
2011-06-15 ~ 2013-06-14 |
Exa-Scale Intelligent Neocortical Computing (NeuroCloud) Chip Research: Algorithm, Architecture, and Implementation Technology- Subproject 4: Bio-Inspired Micro Networking Systemfor Exa-Scale Neocortical Computing
100-2221-E-002-091-MY3 |
Wu, An-Yeu (Andy) |
800000 |
2011-08-01 ~ 2012-07-31 |
Algorithms and Architectures for Thermal/Performance Co-Design in 3D NoC Systems
NSC101-2220-E-002-013 |
Wu, An-Yeu (Andy) |
2679000 |
2012-05-01 ~ 2013-04-30 |
Exa-Scale Intelligent Neocortical Computing (NeuroCloud) Chip Research: Algorithm, Architecture, and Implementation Technology- Subproject 4: Bio-Inspired Micro Networking Systemfor Exa-Scale Neocortical Computing
100-2221-E-002-091-MY3 |
Wu, An-Yeu (Andy) |
975000 |
2012-08-01 ~ 2013-07-31 |
Data Compression Engine for LCD Driver IC
102-S-C05 |
Wu, An-Yeu (Andy) |
1200000 |
2013-02-01 ~ 2014-01-31 |
Algorithms and Architectures for Thermal/Performance Co-Design in 3D NoC Systems
NSC102-2220-E-002-001 |
Wu, An-Yeu (Andy) |
2897000 |
2013-05-01 ~ 2014-07-31 |
Exa-Scale Intelligent Neocortical Computing (NeuroCloud) Chip Research: Algorithm, Architecture, and Implementation Technology- Subproject 4: Bio-Inspired Micro Networking Systemfor Exa-Scale Neocortical Computing
NSC100-2221-E-002-091-MY3 |
Wu, An-Yeu (Andy) |
975000 |
2013-08-01 ~ 2014-07-31 |
High-Efficiency Phosphorescence OLED with Optimized Doping Processes
|
Wu, Chih-I |
950000 |
2006-01-15 ~ 2007-01-15 |
Theoretical study of Fermi level pinning at the interface of high-k dielectrics
|
Wu, Chih-I |
850000 |
2006-02-01 ~ 2007-01-31 |
Contact resistance to silicide
|
Wu, Chih-I |
900000 |
2007-01-01 ~ 2007-12-31 |
Advanced gate stack
|
Wu, Chih-I |
700000 |
2007-02-01 ~ 2008-01-31 |
Study for the Electromagnetic Susceptibility (EMS) of Printed Circuit Boards in Automobiles
|
Wu, Tzong-Lin |
500000 |
2005-04-01 ~ 2006-03-01 |
Research and development of high-speed interconnect library for system-in-package design applications (1/3)
|
Wu, Tzong-Lin |
961000 |
2005-08-01 ~ 2006-07-01 |
The Study of the Waveguide Characterization of Chromium-Doped Fiber (2/3)
|
Wu, Tzong-Lin |
473 |
2005-08-01 ~ 2006-07-01 |
EMC Research for the Electric System and Integrity Circuits of the Web Camera
|
Wu, Tzong-Lin |
1000000 |
2005-12-01 ~ 2007-11-01 |
EMC Research for Flat Panel Display
|
Wu, Tzong-Lin |
950000 |
2006-01-01 ~ 2007-12-01 |
Research and development of high-speed interconnect library for system-in-package design applications (2/3)
|
Wu, Tzong-Lin |
980000 |
2006-08-01 ~ 2007-07-31 |
The Study of the Waveguide Characterization of Chromium-Doped Fiber (3/3)
|
Wu, Tzong-Lin |
494000 |
2006-08-01 ~ 2007-07-31 |
Novel Power lntegnity Solutions in IC Package:Embedded Capacitance and Photonic Crystal Substrate
|
Wu, Tzong-Lin |
400000 |
2007-01-01 ~ 2007-12-31 |
SiP EM Analysis and EBG Implem
|
Wu, Tzong-Lin |
800000 |
2007-06-01 ~ 2008-05-31 |
Analysis of Electrical Performance for High-Speed Package Integrated Memory System
|
Wu, Tzong-Lin |
695600 |
2007-06-01 ~ 2008-05-31 |
Research and development of high-speed interconnect library for system-in-package design applications (3/3)
|
Wu, Tzong-Lin |
957000 |
2007-08-01 ~ 2008-07-31 |
EMC Research for Flat Panel Display
|
Wu, Tzong-Lin |
900000 |
2007-08-01 ~ 2008-07-31 |
Conformal Shielding Investigat
|
Wu, Tzong-Lin |
800000 |
2008-10-01 ~ 2009-03-01 |
Conformal Compartment Shielding Investigation for Wireless SiP Module
|
Wu, Tzong-Lin |
800000 |
2010-06-01 ~ 2011-05-31 |
System-Level Signal-/Power-Integrity Analysis and Measurement for USB 3.0 chip-Package Interconnect and Testing Board
|
Wu, Tzong-Lin |
0 |
2011-01-03 ~ 2011-12-30 |
Modeling And Solutions For Noise Decoupling And Isolation For Power Distribution Networks In 3D-IC Systems
|
Wu, Tzong-Lin |
0 |
2011-02-01 ~ 2012-02-01 |
PCB Design for SerDes Electromagnetic Interference and Signal Integrity
|
Wu, Tzong-Lin |
0 |
2015-01-01 ~ 2015-12-31 |
Signaling quality improvement on RF interface
|
Wu, Tzong-Lin |
0 |
2015-04-16 ~ 2016-04-15 |
Development of High Efficiency OLEDs (1/3)
MOST 103-3113-E-002 -009 |
Wu, Chung- Chih |
5000000 |
2014-04-01 ~ 2014-12-31 |
Development of High Efficiency OLEDs (2/3)
MOST 104-3113-E-002-008 |
Wu, Chung- Chih |
4779000 |
2015-01-01 ~ 2015-12-01 |
Investigations on next-generation OLED technologies
MOST 104-2221-E-002 -152 -MY3 |
Wu, Chung- Chih |
6799000 |
2015-08-01 ~ 2018-07-01 |
Development of High Efficiency OLEDs (3/3)
MOST 105-3113-E-002-008 |
Wu, Chung- Chih |
4890000 |
2016-01-01 ~ 2016-12-01 |
Development of high-performance and functionality transparent OLEDs
MOST 105-2221-E-002 -162 -MY3 |
Wu, Chung- Chih |
6109000 |
2016-08-01 ~ 2019-07-01 |
Development of advanced and functionality transparent conductors and optoelectronic applications
MOST 107-2221-E-002 -160 -MY3 |
Wu, Chung- Chih |
5226000 |
2018-08-01 ~ 2021-07-01 |
Computer Aided Analysis for VLSI Packaging Capacitance
NSC77-0404-E002-08 |
Wu, Ruey-Beei |
291000 |
1987-08-01 ~ 1988-07-01 |
Multiple Scattering of Complex Two- Dimensional Conductors
NSC78-0404-E002-28 |
Wu, Ruey-Beei |
135000 |
1988-08-01 ~ 1989-07-01 |
Inductance Computations for Three-Dimensional Multiconductor Packaging Structures
|
Wu, Ruey-Beei |
680000 |
1989-03-01 ~ 1990-02-01 |
Propagation Properties of Polarization Maintaining Fibers
NSC79-0417-E002-09 |
Wu, Ruey-Beei |
308000 |
1989-08-01 ~ 1990-07-01 |
DC Electrical Analysis for Three-Dimensional Packaging Structures
NSC79-0404-E002-17 |
Wu, Ruey-Beei |
489000 |
1989-08-01 ~ 1990-07-01 |
Analysis of Microstrip Discontinuity
CS78-0210-D002-24 |
Wu, Ruey-Beei |
794000 |
1989-08-01 ~ 1990-07-01 |
Computer-Aided Analysis System for Electrical Properties of Ceramic Packaging Wirings
|
Wu, Ruey-Beei |
350000 |
1990-08-01 ~ 1991-07-01 |
Analysis of Microstrip Discontinuity
CS80-0210-D002-04 |
Wu, Ruey-Beei |
1288000 |
1990-08-01 ~ 1991-07-01 |
Time-Domain Simulation for Transmission Lines
NSC80-0404-E002-36 |
Wu, Ruey-Beei |
480000 |
1990-08-01 ~ 1991-07-01 |
Equivalent Circuit for Vias in Multi-layer Structures
|
Wu, Ruey-Beei |
1000000 |
1991-03-01 ~ 1992-02-01 |
Analysis of Coplanar Waveguide Discontinuities
CS81-0210-D002-08 |
Wu, Ruey-Beei |
741000 |
1991-08-01 ~ 1992-07-01 |
Electrical Analysis of Wirings in Thin-Film Packaging
NSC82-0404-E002-153, 83-0404-E002-053 |
Wu, Ruey-Beei |
1540000 |
1992-08-01 ~ 1994-07-01 |
Analysis of Coplanar Waveguide Discontinuities
CS82-0210-D002-022 |
Wu, Ruey-Beei |
1067000 |
1992-08-01 ~ 1993-07-01 |
Electrical Characterization and Design of Lossy Packaging Wiring
|
Wu, Ruey-Beei |
630000 |
1993-07-01 ~ 1994-05-01 |
Composite Material Backed Antennas
NSC83-0404-E002-003 |
Wu, Ruey-Beei |
312000 |
1993-08-01 ~ 1994-07-01 |
Address：No.1, Sec. 4, Roosevelt Road, Taipei, Taiwan 106