| Research Projects |
Advisor |
Budget |
Duration |
Analysis of Signal Integrity and Plane Noise Issues for High-Speed Digital Circuits
|
Wu, Ruey-Beei |
990000 |
2007-01-01 ~ 2007-12-01 |
Analysis of Electrical Performance for High-Speed Package Integrated Memory System
|
Wu, Ruey-Beei |
5600000 |
2007-05-01 ~ 2009-04-01 |
Analysis and Guideline Establishment for SI / PI Performance of SiP Interconnection
|
Wu, Ruey-Beei |
800000 |
2007-06-01 ~ 2008-05-01 |
RF-SOP Integration Technology (2/2)
96R0062-AE00-08 |
Wu, Ruey-Beei |
6000000 |
2007-08-01 ~ 2008-07-01 |
Design of Stacked SOP Filters and Transitions
NSC96-2219-E002-017, 97-2219-E002-014 |
Wu, Ruey-Beei |
2754000 |
2007-08-01 ~ 2009-07-01 |
High-Frequency Electrical Characterization of Multi-Conductor Matrix Transmission Structure
|
Wu, Ruey-Beei |
659000 |
2007-11-01 ~ 2008-10-01 |
Electrical Analysis and Compensation Design for Gbps Packaging Interconnections
NSC97-2221-E002-062-MY3 |
Wu, Ruey-Beei |
3098000 |
2008-08-01 ~ 2011-07-01 |
Advanced Microwave and SOP Integration Technologies
97R0062-03, 98R0062-03, 99R0062-03 |
Wu, Ruey-Beei |
28950000 |
2008-08-01 ~ 2011-07-01 |
Development of 60GHz Font End Phased Array MMIC, Antennas, and Packaging
98-S-C12 |
Wu, Ruey-Beei |
14000000 |
2009-03-01 ~ 2011-02-01 |
Filters Design using LTCC technology
NSC98-2219-E002-007, 99-2219-E002-007, 100-2219-E002-003 |
Wu, Ruey-Beei |
4802000 |
2009-08-01 ~ 2012-07-01 |
Analysis of Eye-Diagram Characteristic for High speed interconnection Design in Industrial Personal Computer Platform
|
Wu, Ruey-Beei |
1900000 |
2010-06-01 ~ 2012-05-01 |
Noise Mechanism and Mitigation for TV Tuner Cards
100-S-25 |
Wu, Ruey-Beei |
712000 |
2011-01-01 ~ 2011-12-31 |
Modeling, Simulation, and Design for Through Silicon Via Interconnects and Substrate Noise Coupling in 3D IC Stacking Applications
|
Wu, Ruey-Beei |
2300000 |
2011-02-15 ~ 2013-02-28 |
Minimeterwave and System-in-package technologies
AE01-03 |
Wu, Ruey-Beei |
6000000 |
2011-08-01 ~ 2012-07-31 |
Analysis and Design for Signal Integrity in 3D IC Packaging
NSC 100-2221-E-002 -223 -MY3 |
Wu, Ruey-Beei |
2700000 |
2011-08-01 ~ 2014-07-31 |
Development of E-Band Diplexers by LTCC
|
Wu, Ruey-Beei |
1058000 |
2011-08-01 ~ 2012-07-31 |
Signal/Power Integrity Analysis and Design for Chips, Packaging, and PCBs in High-Speed DDR3 Memory System
|
Wu, Ruey-Beei |
1500000 |
2012-03-01 ~ 2014-02-01 |
Electromagnetic Education Promotion Center
|
Wu, Ruey-Beei |
6073000 |
2012-04-01 ~ 2013-03-31 |
Development of Multilayer SiP Components and Integration Techniques
NSC 101-2219-E-002 -005; 102-2219-E-002 -002 |
Wu, Ruey-Beei |
3577000 |
2012-05-01 ~ 2014-04-30 |
Signal and Power Integrity Co-Simulation and Design for Industrial Personal Computer System
|
Wu, Ruey-Beei |
1900000 |
2012-07-01 ~ 2014-06-30 |
3D Transistors and 3D Interconnects for Advanced VLSI Systems
NSC101-2218-E-002 -010; 102-2218-E-002 -003, 103-2218-E-002-003 |
Wu, Ruey-Beei |
26568000 |
2012-09-01 ~ 2015-08-31 |
E-band System in Package Components, Techniques, and Integration
MOST 103-2221-E002-052 |
Wu, Ruey-Beei |
900000 |
2014-08-01 ~ 2015-07-31 |
E-band System in Package Components, Techniques, and Integration
MOST 103-2221-E002-052 |
Wu, Ruey-Beei |
900000 |
2014-08-01 ~ 2015-07-31 |
Signal/Power Integrity Analysis and Design for Chips, Packaging, and PCBs in One to Multiple DDR3 Memory System
|
Wu, Ruey-Beei |
750000 |
2014-09-01 ~ 2015-08-31 |
Electrical Modeling and Design for TSV array in Wide IO
103H32046, 103-S-B22 |
Wu, Ruey-Beei |
1259000 |
2014-10-01 ~ 2015-02-28 |
Fast Analysis of Spurious Emissions and High Speed Signal Equalization for Industrial Personal Computer
|
Wu, Ruey-Beei |
950000 |
2014-10-01 ~ 2015-09-30 |
Signal and Power Integrity Analyses for Wafer Level Packaging in High-Speed Memory Applications
|
Wu, Ruey-Beei |
1670000 |
2015-03-01 ~ 2016-12-31 |
Reconfigurable Circuits and SI/PI Design in Advanced Wafer Level Packaging Technology for Next Generation Mobile Platform
MOST 104-2221-E-002 -055 -MY3 |
Wu, Ruey-Beei |
3167000 |
2015-08-01 ~ 2018-07-31 |
Integrity-aware Hybrid Layout Design for one to Multiple DDR3 and EMI Mitigation for PCB
|
Wu, Ruey-Beei |
750000 |
2015-12-01 ~ 2016-11-30 |
Key Modules Development by WLP for SerDes and ADAS Applications
|
Wu, Ruey-Beei |
2090000 |
2017-01-01 ~ 2018-12-31 |
SIPI/EMI Solution for High-Speed Signaling Design and Noise Suppression
|
Wu, Ruey-Beei |
1500000 |
2017-01-01 ~ 2018-12-31 |
Research on Long-Endurance UAV
|
Wu, Ruey-Beei |
42525000 |
2017-01-01 ~ 2023-12-31 |
Analysis of High Electromechanical Coupling Constants Acoustic Wave Resonator and Reconfigurable Filter Design Using Coupling Capacitors for Next Generation Mobile Platform
MOST 106-2221-E- 002-013-MY3 |
Wu, Ruey-Beei |
2598000 |
2017-08-01 ~ 2020-07-31 |
UAV-IoT and its long-range wireless geo-location tracking applications
107L893001 |
Wu, Ruey-Beei |
448000 |
2018-06-01 ~ 2019-05-31 |
Smart Networking, Sensing, and Perception Technologies for Unmanned Aircraft System Traffic Management (UTM) - Sub 1: Smart Multi-Protocol Drone Transponders in UTM
108L893701 |
Wu, Ruey-Beei |
1600000 |
2019-01-01 ~ 2020-12-31 |
Eye Diagram Co-Simulation and DNN Modeling for Electrical and Optical Channels in SerDes
08HZA38001 |
Wu, Ruey-Beei |
1200000 |
2019-01-01 ~ 2019-12-31 |
Package Modeling and Mitigation for Digital to RF De-sense
|
Wu, Ruey-Beei |
1800000 |
2019-02-01 ~ 2021-01-31 |
Development of AW Filters and Multiplexers for Carrier Aggregation in 5G Systems
MOST 109-2221-E-002-172-MY3 |
Wu, Ruey-Beei |
3696000 |
2020-08-01 ~ 2023-07-31 |
Indoor Positioning System by Hybridizing Wireless Signal and Optical Recognition
|
Wu, Ruey-Beei |
1150000 |
2020-09-01 ~ 2021-08-31 |
Package Modeling and Mitigation for Digital to RF De-sense
|
Wu, Ruey-Beei |
1800000 |
2021-02-01 ~ 2023-01-31 |
Packaing High-Frequency High-Speed Design and Measurement for Next-Generation Substrate Technology
93F018 |
Wu, Ruey-Beei |
20400000 |
2021-03-01 ~ 2024-02-28 |
Signal Integrity Analysis for SerDes Modules in Advanced PC
|
Wu, Ruey-Beei |
1150000 |
2021-04-01 ~ 2022-03-31 |
Integrated EDA Tool of Cross-Module Digital Signaling for Industrial Bridges
MOST 110-2622-8-002- 013-SB |
Wu, Ruey-Beei |
7200000 |
2021-04-01 ~ 2023-03-31 |
Technical Standard and Regulation Establishment for Remote ID in Drones
|
Wu, Ruey-Beei |
900000 |
2021-07-01 ~ 2022-06-30 |
High-precision UWB Positioning and Robust Positioning Control for UAVs and Their Civil Applications
NTU-CC-111L894501 |
Wu, Ruey-Beei |
700000 |
2022-01-01 ~ 2022-12-31 |
Broadband PCB Design with Electromagnetics-Based Artificial Intelligence Analysis
|
Wu, Ruey-Beei |
1150000 |
2022-04-01 ~ 2023-03-31 |
Synthesis and Simulation Design for Acoustic Wave Hexaplexers
|
Wu, Ruey-Beei |
600000 |
2022-07-01 ~ 2022-12-31 |
DDRS-Parameter Based Fast Eye-Diagram Analysis
|
Wu, Ruey-Beei |
1400000 |
2022-07-01 ~ 2023-06-30 |
Dipole Moment Extraction and CPB Co-Design for RF De-Sense
|
Wu, Ruey-Beei |
1840000 |
2023-02-01 ~ 2025-01-31 |
SI/PDN/Thermal Integrity-performance of Stacking and Interconnect Designs for 3DIC and Chiplet Packaging Applications
112HZA38003 |
Wu, Ruey-Beei |
2300000 |
2023-07-01 ~ 2025-06-30 |
Address：No.1, Sec. 4, Roosevelt Road, Taipei, Taiwan 106